Our Principals

(Please click on the company logo to be directed to each principals website)

The Cobehn product line includes universal solvent cleaning systems for precision processing when critical cleaning is required. Uses include hybrids, optics, SMT, precision mechanics, small metal parts and PCB up to 6" square. Unique spray delivery process enhances the performance of any solvent removing flux, oils, particulate in an enclosed chamber with a gentle solvation/agitation and thorough drying.

CRYSTAL MARK, Incorporated offers a variety of micro-sandblast machines for complete process control with independently adjustable air pressure and powder flow regulation, easily interchangeable powder orifice plates, and simple access to all of the components throughout the abrasive pathway for easy maintenance.

Cygnet Incorporated is a premiere, full service metal forming company utilizing the latest advanced technologies. Cygnet also provides laser cutting and related operations for components and assemblies. With an in-house tool and die department Cygnet will guarantee the tools for the life of our part manufacturing. Shop floor tracking is computerized ensuring that your parts on schedule and they do offer JIT keeping your parts flowing smoothly. No job is too small and quality is always a top concern.

EMC Global Technologies Incorporated product line includes the Cybercleanä series (1000, 2000, 3000,4000) of board, stencil and component cleaning systems. The Cyberclean 6000 Aqueous PCB batch cleaner is microprocessor controlled with over 60 programmable recipes. The system incorporates a high-grade stainless steel cleaning chamber, high volume, low pressure spray wands and is CE approved.

EMC offers a full line of fixtures for wave solder pallets, work board holders, process carriers, conformal coat fixtures custom built using composite materials.

EMC manufacturers custom fixtures for all types of specialized requirements, such as Design & fabrication, Router fixtures, Vacuum fixtures, Robotic assembly fixtures, Any tool to provide easy, repetitive setups, just to name a few. When you have that special application that requires precession fixturing let us evaluate your need and provide you a solution.

Midas Technology produces the Model DL-4 industry standard hybrid package delidder system for removing lids from hermetically sealed packages including TO-Style packages. The Model HGRS-IV-P Hot Gas Rework Station is an advanced component removal system for die attached using epoxy, solders or eutectic bonds. The Model EPP-201A Epoxy Die Bonder dedicated to R&D labs, low volume lines and growing shops seeking through-put and more consistent bonding.

NorCom Systems Incorporated manufactures real-time leak inspection equipment for hermetically sealed packages. The LT-5100 Optical Leak Test System measures the leak rate of hermetically sealed packages, using a computer controlled laser interferometer to detect sub micron deflections of the package lids as the pressure is changed in a pressure chamber. This new test technology is user friendly and environmentally safe. The LT-5100 will leak test a broad range of metal lid packages and hybrids over the full spectrum of leak conditions, from gross to fine leaks.

SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing solutions to the worldwide electronics industry.

SST’s team of leading engineers and technologists are constantly advancing the state-of-the-art in microelectronic package assembly techniques, processes and equipment.

Sikama International produces reflow soldering systems for surface mount technology and hybrid circuit reflow manufacturing. Systems are efficient and economical using Conduction + Convection method with no chemical requirement for successful solder reflow operations.

Non-soldering applications include drying, thick film ink, curing epoxy, conductive epoxy coating, lid sealing and drying solder mask. Featuring the Falcon 5X5, 5C, 8C, 8500, 1200, Ultra Profile 2000 & 4000, model 412 ICS In-line coating system and Digital Hot Plates.