The Royce 600 series of Bond Testers offers world-class bond testing. Ranging from the simple and easy-to-use 610 dedicated pull tester to the 650 Universal Bond Tester, we are sure to provide a solution to fit your needs. Royce Instruments has continued to make a name for themselves with reliability and customer service, and there is no doubt why they continue to be a "household" name in the bond testing market.

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Manufacturer's Website: https://vtekusa.com/bond-testers

A semi-automated die sort solution, the DE35-VC harnesses Royce's decades of experience in the die sort field. This user-operated die-sort machine allows for extremely quick changeover to satisfy the technician who has to pick multiple part sizes. Options include: die inversion, underside and facet inspection stage, output to Gel-Pak and waffle pack. This tool is phenomenal for sorting fragile materials, such as GaAs and MEMS devices.

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The AP+ is Royce's Automated Die Sort solution. The AP+ offers a fully automated die sort solution, capable of handling up to 300mm wafers. Royce is able to provide output to waffle pack, Gel-Pak, and tape and reel. The AP+ can be configured with die-inversion, fully automated 6-side Keyence AOI inspection, and non-surface contact picking. The AP+ comes standard with the Royce Die Sort Manager software suite to allow the user to pick from a known wafer map, or to create their own map on umapped wafers. As always, the AP+ is highly adaptable and easy to change for various device sizes.

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Manufacturer's website: https://vtekusa.com/die-sorters